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SMT line body
Equipment and specifications
manufacturer: DEK model: E-BY DEK
printing speed: 2 mm/s–150 mm/s Stencil-to-board Repeatability:1.66 Cpk @ ± 25 μm
PCB size: 40 mm × 50 mm to 510 mm × 508 mm
PCB thickness：0.2 mm–6 mm
Solder paste printing machine
Solder paste inspection machine
manufacturer: KOHYOUNG model: 8030-2
precision: X,Y: 20 µm; Z: 1 µm
PCB size: 50 mm × 50 mm to 510 mm × 460 mm
detection type: high, area, volume, offset, bridge
manufacturer: FUJI model: NXT-3
precision: 0.045 mm/3 σ
PCB size: 50 mm × 50 mm to 510 mm × 460 mm
component size range：01005 chip: 100 mm (L) × 90 mm (W)
High speed placement machine
manufacturer: JTR-1000-N model: JTR-1000-N
temperature accuracy : ± 1.5 °C
Maximum belt speed: 2,000 mm/min.
PCB size: 50 mm–500 mm
reflow soldering
Automatic optical inspection machine
manufacturer: JUTZE model: JT-620
precision: 15 µm speed: 40 mm2/s
PCB 尺寸: 40 mm × 50 mm to 460 mm × 510 mm
Defects such as incorrect components, polarity errors, bridges and missing components can be detected
Universal machine
manufacturer: FUJI model: XP243
patch range：0603-45*150mm，Parts with a height of 25.4mm or less
patch speed：0.43s/chip IC，0.56s/QFP IC。
patch accuracy：±0.025mm
Applicable substrate: maximum 457*356mm, minimum 50*50mm, thickness 0.3-4mm
